-40%
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B
DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B

DaiNippon Dai Nippon Hot Plate Screen Max Press Semiconductor Industrial Tool B

$ 105.6

Availability: 100 in stock
  • Restocking Fee: No
  • All returns accepted: Returns Accepted
  • Return shipping will be paid by: Buyer
  • Country/Region of Manufacture: Japan
  • Brand: DaiNippon
  • Item must be returned within: 30 Days
  • Equipment Type: Semiconductor Tool
  • MPN: TASM0545
  • Condition: Used
  • Refund will be given as: Money Back

    Description

    Dainippon Hot Plate Screen Max Press
    Dai Nippon Manufacturing Co., Japan
    M File No. TASM0545
    E. File No. 2VS00945
    Serial No. T02501126A -7
    CDQSB25-50
    -DCJ1632J
    1.0 MPa
    SMC
    Robotics Tool for Semiconductor Wafer Industrial Manufacturing
    Approximate width 15 1/2 inches
    Approximate length 17 inches
    Approximate height 5 inches
    About 35 1/2 pounds
    Used and Untested.   Upon visual inspection, appears to be in excellent condition.  Will be carefully packaged.
    Returns accepted 30 days from receiving product.  Buyer pays shipping to return.
    Lot B
    The auction is for an untested item that came from a robotics and semiconductor plant that closed.  Please read the description and carefully view the pictures.  I conducted a visual inspection only.  I will carefully pad and pack the item for shipping.  Given the size and weight of the item, I am unable to combine ship this item with other items in my current auctions.  This item is being sold as is, without warranty of any kind, express or implied, including any warranty of merchantability or fitness for any particular purpose.